In a notable movement toward enhancing CPU performance, Intel has introduced its new ILM – the Reduced Load ILM (RL-ILM), but the catch? It's optional! This means that while many high-end motherboard manufacturers have adopted it, others still cling to the original Standard ILM. The reality is that some manufacturers might be tempted to save on costs, potentially compromising the user experience.

What’s the Difference?

At the core of making a CPU socket function properly are two key characteristics: mechanical and electrical properties. Intel utilizes an Independent Loading Mechanism (ILM) within its CPU design. To put that in everyday terms, the ILM is critical for how well a CPU makes contact with the motherboard. Intel distributes two types of ILM – RL-ILM and the older Standard ILM – sourced from at least three different suppliers.

For instance, the Z890 Hero motherboard comes equipped with the RL-ILM from longtime supplier Lotes. This leads us to the fundamental distinction: while the Standard ILM has an angled design that applies pressure at the CPU’s edges leading to potential bending, the RL-ILM is flatter. One of the significant enhancements is a new adhesive spacer in the RL-ILM that seems to take design cues from the popular Noctua NH-D15 cooler.

Performance Testing: Pressure Distribution Matters!

To understand how these ILMs affect CPU performance, our team conducted intricate pressure testing. By inserting a specialized pressure paper between the cooler and CPU, we utilized advanced pressure scanners to create color-coded images mapping pressure distribution.

Our findings revealed that the RL-ILM showed uneven pressure distribution when paired with high convexity coolers. Surprisingly, the Standard ILM, despite its deficiencies, yielded a more consistent pressure across CPU edges, reinforcing its design benefits for certain scenarios.

Moreover, the RL-ILM performed similarly when tested against various Noctua cooler coldplates. It maintained consistent pressure at critical points while showing marginal gaps at edges, hinting at room for improvement in future designs.

Laser Scans: Are Intel's CPUs Flat Enough?

In our investigations, we examined Intel’s new 285K CPU under laser scans – and the results were quite revealing. The IHS (Integrated Heat Spreader) appeared plain and flat, a stark contrast to its predecessors. This flatness is favorable because it helps ensure better thermal contact with coolers.

When we ran tests with CPUs socketed into the Z890 Hero motherboard, the RL-ILM displayed significantly less central deflection compared to the Standard variant. With impressive consistency, the RL-ILM represents notable advancements in Intel's design strategy.

Real-World Thermal Results